Evaluation of 11 Exemptions Under RoHS Pack 23 is Launched


22 March 2021

Circuits from a mother board-1Bio Innovation Service has announced the launch of the consultation for the evaluation of Annex III exemptions. Pack 23, as the study is known, will entail the evaluation of 11 exemptions.

The list of exemptions subject to evaluation include:

Exemption 4(f): Mercury in other discharge lamps for special purposes not mentioned in the Annex.

Exemption 8(b): Cadmium and its compounds in electrical contacts.

Exemption 8(b)-I: Cadmium and its compounds in electrical contacts used in:

  • Circuit breakers
  • Thermal sensing controls
  • Thermal motor protectors (excluding hermetic thermal motor protectors)
  • AC switches rated at:
    • 6 A and more at 250 V AC and more, or
    • 12 A and more at 125 V AC and more
  • DC switches rated at 20 A and more at 18 V DC and more, and
  • Switches for use at voltage supply frequency ≥ 200 Hz

Exemption 9(a)-II: Up to 0.75 % hexavalent chromium by weight, used as an anticorrosion agent in the cooling solution of carbon steel cooling systems of absorption refrigerators that are:

  • Designed to operate fully or partly with electrical heater, having an average utilized power input ≥ 75 W at constant running conditions
  • Designed to fully operate with non-electrical heater

Exemption 13(a): Lead in white glasses used for optical applications.

Exemption 13(b): Cadmium and lead in filter glasses and glasses used for reflectance standards.

Exemption 13(b)-I: Lead in ion colored optical filter glass types.

Exemption 13(b)-II: Cadmium in striking optical filter glass types, excluding applications falling under point 39 of Annex III.

Exemption 13(b)-III: Cadmium and lead in glazes used for reflectance standards.

Exemption 15 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages.

Exemption 15(a) Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit flip chip packages where at least one of the following criteria applies:

  • A semiconductor technology node of 90 nm or larger
  • A single die of 300 mm2 or larger in any semiconductor technology node
  • Stacked die packages with die of 300 mm2 or larger, or silicon interposers of 300 mm2 or larger

All relevant documents, including exemption requests and clarifications, along with consultation questionnaires are available here. Feedback on exemption questionnaires is sought by 27 May 2021. 

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